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--光纤通讯用陶瓷热沉 |
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--标准薄膜陶瓷热沉一览 |
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长宽 \ 代码 |
A |
B |
C |
D |
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0.010"*0.010"
(0.254*0.254mm) |
M1010A010A |
M1010A010B |
M1010A010C |
M1010A010D |
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0.015"*0.015"
(0.381*0.381mm) |
M1515A010A |
M1515A010B |
M1515A010C |
M1515A010D |
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0.020"*0.020"
(0.508*0.508mm) |
M2020A010A |
M2020A010B |
M2020A010C |
M2020A010D |
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0.025"*0.025"
(0.635*0.635mm) |
M2525A010A |
M2525A010B |
M2525A010C |
M2525A010D |
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0.030"*0.030"
(0.762*0.762mm) |
M3030A010A |
M3030A010B |
M3030A010C |
M3030A010D |
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0.035"*0.035"
(0.889*0.889mm) |
M3535A010A |
M3535A010B |
M3535A010C |
M3535A010D |
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0.040"*0.040"
(1.016*1.016mm) |
M4040A010A |
M4040A010B |
M4040A010C |
M4040A010D |
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0.050"*0.050"
(1.27*1.27mm) |
M5050A010A |
M5050A010B |
M5050A010C |
M5050A010D |
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【注】以上标准产品型号均指基片材质为96.0%三氧化二铝，基片厚度为0.010" (0.254mm) ，A型产品留边量为0.002”（0.051mm）。 |
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--客户定制产品参数表： |
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项目 |
可 选 项 |
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形状 |
不限 |
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长×宽 |
不限 |
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厚度 |
0.127mm，0.254mm，0.381mm，0.508mm |
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基板材料 |
三氧化二铝（AL2O3)、氮化铝（ALN）、氧化铍（BeO） |
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